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    • Microfluidics Fab
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  • Microfluidics Fab

Fabrication Equipment

Desktop Photolithography Machine

Desktop Photolithography Machine

Desktop Photolithography Machine

 Exposed Light Source: UV LED
Wavelength: 365 nm
Exposure Area: 4 inches
Exposure Method: Single-side contact type, timing exposure
Exposure Resolution: 2 μm
Exposure Intensity: Adjustable, 20–200 mW/cm²
Exposure Non-uniformity: 10%
Light Source Parallelism: < 5°
Light Source Lifetime: 20,000 hours
Power Supply Input: AC 220V ±10V, 50 Hz
Power Consumption: 250 W
Weight: 25 kg
Overall Dimensions: 382 mm (L) × 371 mm (W) × 435 mm (H)
Working Environment: Temperature 0°C–40°C, relative humidity < 80% 

Spin Coater

Desktop Photolithography Machine

Desktop Photolithography Machine

 

Speed Range and Timing


  • Grade I: 50–10,000 rpm, time adjustable from 0–999 s
  • Grade II: 50–10,000 rpm, time adjustable from 0–999 s

Applicable Substrates: 5–100 mm diameter silicon wafers and other materials for uniform glue application
Speed Stability: ±1%
Glue Uniformity: ±2%
Electrode Power: 40 W, single-phase 110–240 V
Vacuum Pump Rate: > 60 L/min
Weight: Glue homogenizer: 6.5 kg; Pump: 9 kg
Instrument Dimensions: 210 mm × 220 mm × 160 mm

Microscope

Desktop Photolithography Machine

Digital Thickness Gauge (Micrometer)

 

Observation Head: Hinged trinocular observation head, inclined at 30°, interpupillary distance 48–75 mm
Eyepiece: Wide field eyepiece 10X/22
Objective Lenses: Infinite flat field achromatic objectives:

  • 4X/0.1, WD = 17.3 mm
  • 10X/0.25, WD = 10.0 mm
  • 20X/0.4, WD = 5.10 mm
  • 40X/0.65, WD = 2.90 mm
    Nosepiece: Four-hole nosepiece
    Stage: 300 × 268 mm, movement range 250 × 250 mm
    Focusing Mechanism: Coaxial coarse and fine focusing, travel range 24 mm
    Illumination System: 6V 20W halogen lamp, adjustable brightness
    Color Filters: Blue, yellow, green, frosted glass
    Imaging System: 5-megapixel camera

Digital Thickness Gauge (Micrometer)

Digital Thickness Gauge (Micrometer)

Digital Thickness Gauge (Micrometer)

 Resolution: 0.001 mm
Tolerance: 0.005 mm
Range: 0–12.7 mm 

Hotplate

Digital Thickness Gauge (Micrometer)

Hotplate

 Voltage: 220V AC
Power: 850W
Temperature Stability: ±1°C
Weight: 4.9 kg
Dimensions: 200 mm × 200 mm 

Oven

Digital Thickness Gauge (Micrometer)

Hotplate

 Temperature Range: 10°C – 300°C
Temperature Resolution: 0.1°C
Temperature Fluctuation: ±0.2°C
Inner Liner Material: Stainless steel
Internal Dimensions: 35 × 35 × 35 cm (L × D × H)
External Dimensions: 46 × 56 × 64 cm (L × D × H)
Power Supply: 220V
Power Consumption: 0.8 kW 

Vaccum Degasser

Vaccum Degasser

 Material: Polycarbonate (PC)
Vacuum Maintenance: Long vacuum retention time
Sealing: Oil-free sealing ring
Included Accessories: Vacuum gauge and vacuum pump 

PDMS pourloader

Vaccum Degasser

 Material: PMMA
Vacuum Adsorption: Suitable for silicon wafers
Specification: Designed for 4-inch and smaller SU-8 molds or pure silicon mold casting 

Electronic scale

 Range: 1000 g
Accuracy: 0.01 g
Tray Type: Square tray, 16 × 18 cm 

PDMS chip alignment platform

PDMS chip alignment platform

 Suitable Samples: PDMS with PDMS
Alignment Accuracy: ±2 μm

Microscope Parameters:

  • Total Magnification: 20–200X continuous zoom
  • Main Objective Magnification: 0.7–4.5X, continuously variable
  • Eyepiece Magnification: 0.5X
  • Lifting Range: 270 mm
  • Center Range: 150 mm
  • Focusing Range: 65 mm
  • Display Screen: 13.3-inch high-definition display

Camera Parameters:

  • Output Resolution: HDMI 1920×1080P
  • Chip Size: 1/2.8"
  • Supported Functions: Real-time display, photography, recording, measurement, etc.

Plasma cleaning machine

PDMS chip alignment platform

Plasma cleaning machine

 Chamber Material: Stainless steel
RF Power: Adjustable from 0 to 300 W
Internal Cavity Size: Diameter 150 mm × 270 mm
Output Frequency: 13.56 MHz
Adjustment: Manual 

Hole punch & Cutter

PDMS chip alignment platform

Plasma cleaning machine

 Cutting Thickness: ≤8 mm
Accessories Included: PU pad 


 

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